LLM Analysis
Building a diversified portfolio of AI infrastructure suppliers focusing on critical but less obvious components: memory (MU), testing (AEHR), cooling (VRT), packaging (AMKR), and interconnects (MRVL). These companies address specific bottlenecks in LLM deployment - memory bandwidth, chip reliability, thermal management, advanced packaging capacity, and inter-GPU communication. Deploying 80% of capital provides good exposure while maintaining cash buffer for opportunities or volatility management.